Layer：

4-46

Diameter of mechanical drilling

Min. plating hole

Line/Space on inner layer

0.075 mm/0.075mm (H OZ)
0.075 mm/0.075mm (H OZ)

Line/Space on outer layer

0.1/0.1mm (1 OZ )
0.1/0.1mm (1 OZ )

Impedance

+/- 10%

Aspect Ratio

Max: 12:1

Delivery Panel Size:

Max. 570mm×508mm  Min：50×50mm

Board Thickness

<128mil（3.2mm）

Core Material Thickness

Min. 0.1mm

Pitch

Min. Distance between SMT pads : 0.3mm
Min. Distance between BGA:  0.45mm

Board Thickness:

±10%             （Thickness≥0.8mm）
±0.1mm           （Thickness＜0.8mm）

Base copper thickness on inner layer

H~6 OZ

Outer layer copper thickness

T~2Oz  Multilayer
T~5Oz  Double sided

Etching tolerance of inner/outer layer

±20%

Hole diameter tolerance

 ± 0.05mm for NPTH
±0.075mm for PTH

Tolerance for hole position

±0.075 mm

Hole wall roughness (Max)

0.050mm

Size for plated abnormal (Max)

4.5*6.0mm

Drilled long slot size (Min.)

0.5mm

Shape tolerance for drilled long slot

Width tolerance: +/-0.05mm
Length tolerance: +0.05/-0.075mm

Long slot position tolerance

+/-0.1mm

Hole distance ( different nets)

MIN：0.5mm

Hole wall copper thickness (via)

≥25um

Average copper thickness in holes

30um

Layer Misalignment

0.1mm

Hole position precision on outer pattern （Min）

±0.075 mm

Tolerance from pattern to pattern (min)

±0.05mm

Min. Misalignment for solder mask

±0.035mm

Solder mask thickness

Min：10um(on line)  
5um (on shoulder edge)

Min. Solder mask bridge width

0.08mm

Hole diameter for plugged hole

0.2mm~0.65mm

Plugging of board with solder mask on 2 sides: min.

80%

Tin thickness for HASL

1~40um

Nickel thickness for immersion gold

3~8um

Gold thickness for immersion gold

0.05~0.1um

OSP thickness

0.2~0.4um

Text in Solder mask

Height: 1.0mm  Width: 0.15mm

Legend Printing

Height：0.8 mm  Width：0.8 mm

Impedance Controlled

+/- 10%

Surface Treatment

Hot Air leveling (HASL), HASL Lead-free, immersion gold, plated hard gold, OSP (Organic Solder Protection), Immersion Silver，flash gold
Immersion Gold + OSP, plated gold + immersion gold

Contour tolerance

±0.1mm

Min Routed arc for inner angle

0.4mm

Min. distance from pattern to routed edge

0.25mm

Depth tolerance for deep routing

+/-0.15mm

V Cut Angle:

15°/25°/30°/60°

Angle tolerance for V-Cut

±10°

Board Thickness for V-Cut

0.5mm~ 2.4 mm

E-Test condition:

50-300V

Isolation resistance:

With test adapter: 2MΩ-100MΩ

Conductive resistance:

Density of test grid: Min.

50 mil

Pitch for test pad: Min

for test with adapter 14mil
for test with flyer test 4mil